US Patent 10162139 Semicondcutor package

Semiconductor packages are provided. The semiconductor package includes a package substrate, a photonic integrated circuit, a laser die, an electronic integrated circuit, and a first redistribution structure. The package substrate includes connectors. The photonic integrated circuit is disposed over the package substrate. The laser die is optically coupled to the photonic integrated circuit. The electronic integrated circuit is disposed over the package substrate. The first redistribution structure is disposed over the package substrate, wherein the electronic integrated circuit is electrically connected to the photonic integrated circuit through the first redistribution structure.