Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 4, 2018
Patent Application Number
15267067
Date Filed
September 15, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments relate to systems and methods for forming a circuit assembly for an electronic device. The circuit assembly may include a substrate and a group of surface-mounted electronic components disposed on a surface of the substrate. An electrical connector may be disposed on the surface and may be configured to receive an electrical connection from a separate electrical component or assembly. A molded layer may be formed over at least a portion of the surface fully encapsulating the group of surface-mounted electronic components and partially encapsulating the electrical connector.
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