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US Patent 10014212 Selective deposition of metallic films
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Patent
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Date Filed
June 14, 2017
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Date of Patent
July 3, 2018
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Patent Application Number
15622510
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Patent Citations Received
US Patent 11446699 Vapor phase deposition of organic films
US Patent 11501965 Plasma enhanced deposition processes for controlled formation of metal oxide thin films
US Patent 11501966 Selective layer formation using deposition and removing
US Patent 11373876 Film forming method and film forming apparatus
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US Patent 11387107 Deposition of organic films
US Patent 11389824 Vapor phase deposition of organic films
US Patent 11396701 Passivation against vapor deposition
US Patent 11404266 Semiconductor devices including a support pattern on a lower electrode structure
US Patent 11430656 Deposition of oxide thin films
US Patent 11830732 Selective passivation and selective deposition
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•••
Patent Inventor Names
Toshiharu Watarai
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Kunitoshi Namba
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Shang Chen
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Takahiro Onuma
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Dai Ishikawa
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10014212
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Patent Primary Examiner
Ratisha Mehta
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