List of Chippac patents

Patents where

Current Assignee

Name

‌

Chippac

Name	Description	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 7217598 Method for manufacturing plastic ball grid array package with integral heatsink	Patent 7217598 was granted and assigned to Chippac on May, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7217598	May 15, 2007
‌ US Patent 7211901 Self-coplanarity bumping shape for flip chip	Patent 7211901 was granted and assigned to Chippac on May, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7211901	May 1, 2007
‌ US Patent 7190058 Spacer die structure and method for attaching	Patent 7190058 was granted and assigned to Chippac on March, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7190058	March 13, 2007
‌ US Patent 7208821 Multichip leadframe package	Patent 7208821 was granted and assigned to Chippac on April, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7208821	April 24, 2007
‌ US Patent 7372170 Flip chip interconnection pad layout	Patent 7372170 was granted and assigned to Chippac on May, 2008 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7372170	May 13, 2008
‌ US Patent 7605480 Flip chip interconnection pad layout	Patent 7605480 was granted and assigned to Chippac on October, 2009 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7605480	October 20, 2009
‌ US Patent 7436048 Multichip leadframe package	Patent 7436048 was granted and assigned to Chippac on October, 2008 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7436048	October 14, 2008
‌ US Patent 7367489 Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps	Patent 7367489 was granted and assigned to Chippac on May, 2008 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7367489	May 6, 2008
‌ US Patent 7101731 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package	Patent 7101731 was granted and assigned to Chippac on September, 2006 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7101731	September 5, 2006
‌ US Patent 7351610 Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate	Patent 7351610 was granted and assigned to Chippac on April, 2008 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7351610	April 1, 2008
‌ US Patent 8970049 Multiple chip package module having inverted package stacked over die	Patent 8970049 was granted and assigned to Chippac on March, 2015 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	8970049	March 3, 2015
‌ US Patent 7494847 Method for making a semiconductor multi-package module having inverted wire bond carrier second package	Patent 7494847 was granted and assigned to Chippac on February, 2009 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7494847	February 24, 2009
‌ US Patent 7306971 Semiconductor chip packaging method with individually placed film adhesive pieces	Patent 7306971 was granted and assigned to Chippac on December, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7306971	December 11, 2007
‌ US Patent 7749807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies	Patent 7749807 was granted and assigned to Chippac on July, 2010 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7749807	July 6, 2010
‌ US Patent 7166494 Method of fabricating a semiconductor stacked multi-package module having inverted second package	Patent 7166494 was granted and assigned to Chippac on January, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7166494	January 23, 2007
‌ US Patent 7306973 Method for making a semiconductor multipackage module including a processor and memory package assemblies	Patent 7306973 was granted and assigned to Chippac on December, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7306973	December 11, 2007
‌ US Patent 7205647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages	Patent 7205647 was granted and assigned to Chippac on April, 2007 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7205647	April 17, 2007
‌ US Patent 7034387 Semiconductor multipackage module including processor and memory package assemblies	Patent 7034387 was granted and assigned to Chippac on April, 2006 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7034387	April 25, 2006
‌ US Patent 8143100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages	Patent 8143100 was granted and assigned to Chippac on March, 2012 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	8143100	March 27, 2012
‌ US Patent 7880313 Semiconductor flip chip package having substantially non-collapsible spacer	Patent 7880313 was granted and assigned to Chippac on February, 2011 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7880313	February 1, 2011
‌ US Patent 7745322 Wire bond interconnection	Patent 7745322 was granted and assigned to Chippac on June, 2010 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7745322	June 29, 2010
‌ US Patent 8129263 Wire bond interconnection and method of manufacture thereof	Patent 8129263 was granted and assigned to Chippac on March, 2012 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	8129263	March 6, 2012
‌ US Patent 7692279 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package	Patent 7692279 was granted and assigned to Chippac on April, 2010 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7692279	April 6, 2010
‌ US Patent 7829382 Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package	Patent 7829382 was granted and assigned to Chippac on November, 2010 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7829382	November 9, 2010
‌ US Patent 7650688 Bonding tool for mounting semiconductor chips	Patent 7650688 was granted and assigned to Chippac on January, 2010 by the United States Patent and Trademark Office.	‌ Chippac	United States Patent and Trademark Office	7650688	January 26, 2010

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