Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajendra D. Pendse0
Hun-Teak Lee0
Jong-Kook Kim0
Ki-Youn Jang0
Chul-Sik Kim0
Date of Patent
March 6, 2012
0Patent Application Number
131783310
Date Filed
July 7, 2011
0Patent Primary Examiner
Patent abstract
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
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