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US Patent D998827 Material having edge shape

Patent D998827 was granted and assigned to Laird (company) on September, 2023 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

Laird (company)

Current Assignee

Laird (company)

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Michael S. Wladyka

Keith David Johnson

Jingting Yang

Jason L. Strader

Mark D. Kittel

Date of Patent

September 12, 2023

Patent Application Number

29731731

Date Filed

April 17, 2020

Patent Citations

US Patent 8445102 Thermal interface material with thin transfer film or metallization

US Patent D690272 Profile for a co-extrusion

US Patent 8545987 Thermal interface material with thin transfer film or metallization

US Patent 7229683 Thermal interface materials and method of making thermal interface materials

US Patent 7488900 Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding

US Patent 7821126 Heat sink with preattached thermal interface material and method of making same

US Patent 7906845 Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor

US Patent D644757 Chamfer strip

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Patent Primary Examiner

Llorelys Martinez

CPC Code

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