US Patent D572669 Heat dissipation assembly
Patent D572669 was granted and assigned to Asia Vital Components Co., Ltd. on July, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 1, 2007
Date of Patent
July 8, 2008
Patent Application Number
29284191
Patent Inventor Names
Shih-Jie Jiang
0
Patent Jurisdiction
Patent Number
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