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US Patent D1026981 Polycrystalline diamond compact with a tripartite raised surface

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 14, 2021
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Date of Patent
May 14, 2024
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Patent Application Number
29811489
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Patent Citations
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US Patent D570384 Substrate for manufacturing cutting elements
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US Patent D581958 Cutting insert
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US Patent D587732 Substrate for manufacturing cutting elements
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US Patent 7658666 Superhard cutters and associated methods
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US Patent 7726420 Cutter having shaped working surface with varying edge chamfer
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US Patent 7798257 Shaped cutter surface
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US Patent 8191657 Rotary drag bits for cutting casing and drilling subterranean formations
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US Patent 8210747 Bearing elements
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US Patent 8540037 Layered polycrystalline diamond
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US Patent 9297411 Bearing assemblies, apparatuses, and motor assemblies using the same
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•••
Patent Inventor Names
Weifeng Du
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Haijiang Fang
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Yongfeng Wang
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Jian Yang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
D1026981
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Patent Primary Examiner
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Patricia A Palasik
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CPC Code
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E21B 10/26
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