An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal.