Patent attributes
In one embodiment, a substrate support bushing for a lift pin used in a semiconductor processing chamber is provided. The bushing includes an elongated housing sized to guide the lift pin in a substrate support pedestal. The housing has a longitudinal bore formed through the housing. The housing includes at least one passageway slot extending and open to substantially the entire length of the bore. In another embodiment, a method for transferring a substrate from a substrate support pedestal is provided. The method includes displacing a lift pin through a central bore toward a substrate disposed on a substrate support pedestal. The bore has at least one slot extending substantially along and open to the central bore. The method further includes spacing the substrate from the substrate support pedestal on the lift pin.
