US Patent 9978735 Interconnection of an embedded die
Patent 9978735 was granted and assigned to Altera on May, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 28, 2016
0
Date of Patent
May 22, 2018
0
Patent Applicant
Patent Application Number
15278289
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Patent Citations Received
Patent Inventor Names
Wai Ling Lee
0
Choong Kooi Chee
0
Loke Yip Foo
0
Mei See Chin
0
Wei Lun Oo
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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