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US Patent 9978720 Insulated die

Patent 9978720 was granted and assigned to Infineon Technologies on May, 2018 by the United States Patent and Trademark Office.

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US Patent 12087679 Package core assembly and fabrication methods

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US Patent 11931855 Planarization methods for packaging substrates

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US Patent 11927885 Fluoropolymer stamp fabrication method

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US Patent 11887934 Package structure and fabrication methods

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US Patent 11881447 Package core assembly and fabrication methods

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US Patent 11862546 Package core assembly and fabrication methods

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Patent abstract

An insulated chip comprising a semiconductor chip comprising at least one chip pad and an electrically insulating layer surrounding at least part of the semiconductor chip.

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US Patent 11837680 Substrate structuring methods

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Patent Inventor Names

Gottfried Beer0

Horst Theuss0

Juergen Hoegerl0

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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

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US Patent 11705365 Methods of micro-via formation for advanced packaging

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US Patent 11676832 Laser ablation system for package fabrication

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US Patent 09978720 Insulated die US Patent 9978720 Insulated die

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Patent Number

099787200

Patent Number

99787200

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Is a

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Patent Applicant

Infineon Technologies

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Current Assignee

Infineon Technologies

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

099787200

Date of Patent

May 22, 2018

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Patent Application Number

152016240

Date Filed

July 5, 2016

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Patent Primary Examiner

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created this topic on 20 Jan, 2022

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US Patent 09978720 Insulated die

Infobox

Is a

Patent applicant

Infineon Technologies

Current assignee

Infineon Technologies

Patent jurisdiction

United States Patent and Trademark Office

Patent number

09978720

Date of patent

May 22, 2018

Patent application number

15201624

Date Filed

July 5, 2016

Patent primary examiner

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