Patent 9962913 was granted and assigned to Bemis Company, Inc. on May, 2018 by the United States Patent and Trademark Office.
The present application describes a multilayer film having low water vapor permeability. The multilayer film of the present application is readily thermoformed and is, therefore, suitable for blister packaging sheets as well as for food packaging, medical barriers and device packaging, and other general purposes where low water vapor permeability is desired.