Patent attributes
In-ear headphone assemblies and related methods are disclosed. An in-ear headphone assembly includes a rigid shell, a rigid nozzle, and a resilient overmold structure permanently molded to the rigid nozzle and the rigid shell. The resilient overmold structure secures a proximal end of the rigid nozzle proximate to a first side of the rigid shell defining a sound aperture. The resilient overmold structure defines a sound passage acoustically coupling a volume defined by the rigid shell to a sound channel of the rigid nozzle through the sound aperture and the proximal end of the rigid nozzle. A method of manufacturing a headphone assembly includes positioning the rigid nozzle and the rigid shell within a cavity of a mold, and injecting a polymer or polymer precursor material into the cavity of the mold.
