US Patent 9952110 Multi-die pressure sensor package
Patent 9952110 was granted and assigned to Infineon Technologies on April, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 29, 2016
0
Date of Patent
April 24, 2018
0
Patent Applicant
Patent Application Number
15084232
0
Patent Inventor Names
Horst Theuss
0
Sebastian Beer
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 9952110 Multi-die pressure sensor package
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.