Patent attributes
A chip package structure is provided. The chip package structure includes a redistribution structure. The chip package structure includes a first chip over the redistribution structure. The first chip has a front surface and a back surface opposite to the front surface, and the front surface faces the redistribution structure. The chip package structure includes an adhesive layer on the back surface. The adhesive layer is in direct contact with the back surface, and a first maximum length of the adhesive layer is less than a second maximum length of the first chip. The chip package structure includes a molding compound layer over the redistribution structure and surrounding the first chip and the adhesive layer. A first top surface of the adhesive layer is substantially coplanar with a second top surface of the molding compound layer.
