US Patent 9899330 Flexible electronic circuits with embedded integrated circuit die
Patent 9899330 was granted and assigned to MC10 on February, 2018 by the United States Patent and Trademark Office.
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Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.
US Patent 09899330 Flexible electronic circuits with embedded integrated circuit die US Patent 9899330 Flexible electronic circuits with embedded integrated circuit die
US Patent 09899330 Flexible electronic circuits with embedded integrated circuit die
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