Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 13, 2018
Patent Application Number
15147617
Date Filed
May 5, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method and device are provided wherein a first semiconductor device and a via are encapsulated with an encapsulant. A redistribution layer connects the first semiconductor device to a second semiconductor device. In a particular embodiment the first semiconductor device is an integrated voltage regulator and the second semiconductor device is a logic device such as a central processing unit.
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