Patent 9891083 was granted and assigned to Honeywell on February, 2018 by the United States Patent and Trademark Office.
A probe assembly includes a heat source; and a probe tip configured to enhance conduction of heat provided by the heat source into a front end tip of the probe. The probe tip includes: a first region having high thermal conductivity in at least a z-direction, wherein the z-direction is parallel to an axis along which the probe tip is extended; and at least one additional region having thermal characteristics different from the first region.