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US Patent 9887313 Method for producing differently doped semiconductors
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Is a
Patent
Date Filed
April 17, 2015
Date of Patent
February 6, 2018
Patent Application Number
15307689
Patent Citations Received
US Patent 11869925 3D printed semiconductor package
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Patent Inventor Names
Christian Guenther
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Odo Wunnicke
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Stephan Traut
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Susanne Christine Martens
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Christoph Mader
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Jasmin Lehmkuhl
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Joachim Erz
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Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9887313
Patent Primary Examiner
Calvin Choi
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