Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 6, 2018
Patent Application Number
15403409
Date Filed
January 11, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.
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