US Patent 9881784 Substrate processing method, substrate processing apparatus, and storage medium

Disclosed is a substrate processing method. The method includes: supplying a rinse liquid, IPA, a first fluorine-containing organic solvent, a second fluorine-containing organic solvent to a wafer within an outer chamber of a liquid processing unit; conveying the wafer to a supercritical processing unit container; and supplying a supercritical processing fluorine-containing organic solvent in a supercritical high-pressure fluid state to the wafer within the supercritical processing unit container. At least during the supply of the IPA, a low-humidity N2 gas is supplied into the outer chamber so that the inside of the outer chamber is formed as a low-humidity N2 gas atmosphere, and thus moisture absorption into the IPA is prevented.