US Patent 9857288 Laser bond inspection with compact surface motion sensor

Patent 9857288 was granted and assigned to LSP Technologies, Inc. on January, 2018 by the United States Patent and Trademark Office.

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Current Assignee

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Patent Number

Patent Inventor Names

David Sokol0

Craig Walters0

Date of Patent

January 2, 2018

Patent Application Number

145307450

Date Filed

November 1, 2014

Patent Primary Examiner

Patent abstract

Methods, systems, and apparatuses are disclosed for laser bond inspection of an angled or compact bonded article.

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