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US Patent 9841772 Temperature responsive thermal bridge

Patent 9841772 was granted and assigned to TE Connectivity on December, 2017 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
TE Connectivity
TE Connectivity
Date Filed
December 3, 2015
Date of Patent
December 12, 2017
Patent Application Number
14958137
Patent Citations Received
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US Patent 11940487 Thermal solution for massively parallel testing
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US Patent 11778786 Thermal bridge for an electrical component
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US Patent 11835549 Thermal array with gimbal features and enhanced thermal performance
0
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US Patent 11841392 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
0
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US Patent 11852678 Multi-input multi-zone thermal control for device testing
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US Patent 11754620 DUT placement and handling for active thermal interposer device
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US Patent 11774492 Test system including active thermal interposer device
Patent Inventor Names
Alan Weir Bucher
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9841772
Patent Primary Examiner
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Robert J Hoffberg

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