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US Patent 9808855 Rivet module and joining structure and method using the same

Patent 9808855 was granted and assigned to Sungwoo Hitech Co. Ltd. on November, 2017 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
‌
Sungwoo Hitech Co. Ltd.
1
Current Assignee
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Sungwoo Hitech Co. Ltd.
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
98088551
Patent Inventor Names
Yun Sung Chung1
Mun Yong Lee1
Date of Patent
November 7, 2017
1
Patent Application Number
145240391
Date Filed
October 27, 2014
1
Patent Primary Examiner
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John C. Hong
1
Patent abstract

A rivet module is provided to join at least two sheets of base materials in a solid state, the rivet module including: i) a shank portion to be mounted on a reciprocal and rotatable joining tool; ii) a base material friction portion that is integrally connected to the shank portion and drills through the base materials as the joining tool causes the base material friction portion to be rotated while applying pressure to the base materials; and iii) a base material fastening portion that is fixedly fitted to the shank portion, supports the base material friction portion, and is fastened to the base materials through a thread formed on the outer peripheral surface thereof.

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