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US Patent 9711452 Optimized wires for resistance or electromigration
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Is a
Patent
Date Filed
December 5, 2014
Date of Patent
July 18, 2017
Patent Application Number
14561514
Patent Citations Received
US Patent 11764145 Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the same
US Patent 11908740 Semiconductor structure with doped via plug
0
Patent Inventor Names
Baozhen Li
0
Lawrence A. Clevenger
0
Kirk D. Peterson
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9711452
Patent Primary Examiner
Calvin Choi
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