Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Philip D. Nguyen0
Brian D Mock0
Date of Patent
June 27, 2017
0Patent Application Number
147807350
Date Filed
November 11, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Various embodiments disclosed relate to methods of treating a subterranean formations that provide enhanced fracture conductivity over other methods. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include obtaining or providing a composition including a tackifier. The composition can have a viscosity less than about 20 cP. The method can include placing the composition in a subterranean formation downhole. The method can also include fracturing the subterranean formation with the composition.
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