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US Patent 9653428 Semiconductor package and fabricating method thereof
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Patent
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Date Filed
July 11, 2016
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Date of Patent
May 16, 2017
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Patent Applicant
Amkor Technology
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Patent Application Number
15207186
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Patent Citations Received
US Patent 12129168 Microelectronics package with vertically stacked MEMS device and controller device
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US Patent 12112999 RF devices with enhanced performance and methods of forming the same
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US Patent 12119295 Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof
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US Patent 12125739 RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
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US Patent 12125776 Method for forming semiconductor package and semiconductor package
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US Patent 12125815 Assembly of 2XD module using high density interconnect bridges
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US Patent 12125825 RF devices with enhanced performance and methods of forming the same
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US Patent 11705362 RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
0
US Patent 11705428 RF devices with enhanced performance and methods of forming the same
0
US Patent 11710704 RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
0
•••
Patent Inventor Names
David Hiner
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Michael Kelly
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Ronald Huemoeller
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9653428
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Patent Primary Examiner
Jasmine Clark
0
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