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US Patent 9646874 Thermally-isolated silicon-based integrated circuits and related methods

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 5, 2013
Date of Patent
May 9, 2017
Patent Application Number
13959136
Patent Citations Received
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US Patent 12028043 Packaging method and packaging structure of FBAR
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US Patent 11682663 Thermally isolated silicon-based display
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US Patent 11762146 Photonics fabrication process performance improvement
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US Patent 11869925 3D printed semiconductor package
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US Patent 11953678 Aberration correction of optical phased arrays
0
Patent Inventor Names
Peggy J. Clews
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Roy H. Olsson
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Kenneth Wojciechowski
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Todd Bauer
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9646874
Patent Primary Examiner
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Natalia Gondarenko

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