US Patent 9629280 Multiple liquid loop cooling for electronics

The present invention relates to liquid cooling systems and more particularly to a liquid cooling system for an electrical system on an air-cooled platform. In one embodiment of the invention, a liquid-cooled system for a platform with air cooling includes an electrical system comprising first and second electrical components; a cooling unit comprising an air flow path, a first heat exchanger in the air flow path, and a second heat exchanger in the air flow path downstream of the first heat exchanger; a first liquid loop passing through the first heat exchanger and the first electrical component; and a second liquid loop passing through the second heat exchanger and the second electrical component. The first liquid loop is substantially thermally isolated from the second liquid loop.