Patent attributes
A layer of a first powder is dispensed in a layer over a build plate. Binder is then selectively applied to hold portions of the layer of first powder together. Unbound first powder is then removed. A second powder is then dispensed in a layer over the build plate and portions of the bound first powder above the build plate. Binder is then selectively applied to hold portions of the second powder together. Unbound second powder is then removed. A third or more different powders can be similarly dispensed and bound to complete a multi-material layer. The process is then be repeated on a next subsequent layer. A curing radiation source can accelerate binding of powder together. Voids can be formed in portions of the layers by dispensing a fugitive material in portions of each multi-material layer. Mechanisms for implementing the printing process are also disclosed.
