Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 21, 2017
Patent Application Number
14974484
Date Filed
December 18, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A laminate includes a buildup layer having a top and a bottom and a solder mask contacting the top. The laminate also includes a circuit element disposed on the top of the buildup layer and at least partially covered by the solder mask, the circuit element including a first via formed therein that allows for a power signal provided to an underside of the circuit element to be provided to a first connection on a top of the circuit element.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
