US Patent 9545669 Layered manufacturing of free-form multi-material micro-components

The present invention relates to layer manufacturing, more particularly to a method for additive layer manufacturing of objects comprised of more than one material with free-form capability for all included materials. The invention can for example be used for producing packaging for Microsystems where the ceramic acts as an insulator and the secondary material is used to produce electrical or optical 3D conductor lines or electrical or optical 3D vias. The fine powder used in this method enables it to be used for building components with small feature size and demand for high precision. Other intended uses for this method is to build small mechanical precision parts or grinding tools, dental objects or medical implants.