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US Patent 9516765 Method for producing printed wiring board

Patent 9516765 was granted and assigned to AJINOMOTO CO., INC. on December, 2016 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
AJINOMOTO CO., INC.
AJINOMOTO CO., INC.
Current Assignee
AJINOMOTO CO., INC.
AJINOMOTO CO., INC.
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9516765
Patent Inventor Names
Shigeo Nakamura0
Tadahiko Yokota0
Yukinori Morikawa0
Date of Patent
December 6, 2016
Patent Application Number
14065924
Date Filed
October 29, 2013
Patent Citations Received
‌
US Patent 12120827 Method for manufacturing printed wiring board and resin sheet with inorganic layer
0
Patent Primary Examiner
‌
Jeremy C Norris
Patent abstract

A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.

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