US Patent 9478885 Electronic module packages and communication assemblies

An electronic module package including an electronic module configured to receive input signals and process the input signals to provide output signals. The electronic module package also includes an interposer that has a substrate with opposite board and module surfaces. The electronic module is mounted to the module surface. The interposer includes electrical contacts along the module surface that are communicatively coupled to the electronic module through the substrate. The electronic module package also includes a connector receptacle having a receptacle housing coupled to the interposer. The receptacle housing defines a reception space that is located over and permits access to the electrical contacts. The connector receptacle is configured to receive an electrical connector within the reception space to electrically couple the electrical contacts and the electrical connector. The connector receptacle holds the electrical connector therein in a mated position.