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US Patent 9478504 Microelectronic assemblies with cavities, and methods of fabrication
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Is a
Patent
Date Filed
June 19, 2015
Date of Patent
October 25, 2016
Patent Application Number
14745237
Patent Citations Received
US Patent 11841531 Wafer scale bonded active photonics interposer
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US Patent 11904312 Microfluidic devices with lid for loading fluid
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US Patent 12087623 Dielectric liners on through glass vias
0
US Patent 12074119 Chip package structure
0
Patent Inventor Names
Guilian Gao
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Charles G. Woychik
0
Hong Shen
0
Liang Wang
0
Rajesh Katkar
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9478504
Patent Primary Examiner
Luan C Thai
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