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US Patent 9478474 Methods and apparatus for forming package-on-packages
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Is a
Patent
Date Filed
December 28, 2012
Date of Patent
October 25, 2016
Patent Application Number
13729902
Patent Citations Received
US Patent 12087746 Microelectronic assemblies having an integrated capacitor
0
US Patent 11854928 Semiconductor package and manufacturing method thereof
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9478474
Patent Primary Examiner
Jenny L. Wagner
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