US Patent 9453764 Devices and methods for analyzing layers of samples

The present disclosure generally relates to systems, devices and methods for analyzing and processing samples or analytes. In one example configuration, a method of analyzing an analyte includes shaving a first layer of a plurality of layers of an analyte to expose a first surface of an analyte. The method includes positioning the first surface of the analyte over a window of a hyperspectral analyzation subassembly. The method further includes scanning the first surface of the analyte by the hyperspectral analyzation subassembly to obtain information regarding the analyte proximate the first surface. Other systems, devices and methods are disclosed herein.