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US Patent 9443783 3DIC stacking device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 14, 2012
Date of Patent
September 13, 2016
Patent Application Number
13619877
Patent Citations Received
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US Patent 12136619 Methods of manufacturing three-dimensional integrated circuit structures
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US Patent 12131974 Semiconductor package and method of manufacturing semiconductor package
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US Patent 12132024 Semiconductor package and method of manufacturing the same
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US Patent 12137566 Peripheral circuitry under array memory device and method of fabricating thereof
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US Patent 11658119 Backside signal interconnection
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US Patent 11658172 Hybrid bonding with through substrate via (TSV)
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US Patent 11664350 Semiconductor device and method of manufacture
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US Patent 11664280 Semiconductor devices with backside air gap dielectric
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US Patent 11664286 Method for forming package structure
0
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US Patent 11664300 Fan-out packages and methods of forming the same
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9443783
Patent Primary Examiner
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John C Ingham

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