Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 29, 2014
Date of Patent
August 23, 2016
Patent Application Number
14289819
Patent Citations Received
‌
US Patent 12136619 Methods of manufacturing three-dimensional integrated circuit structures
0
‌
US Patent 12113031 Semiconductor device and method of making the same
0
‌
US Patent 12119276 Package structure with protective lid
0
‌
US Patent 12119292 Semiconductor device and method of manufacture
0
‌
US Patent 12125755 Chip package structure with cavity in interposer
0
‌
US Patent 12125782 Semiconductor structure and method of forming the same
0
‌
US Patent 12125798 Semiconductor package and method
0
‌
US Patent 12125812 Integrated circuit packages and methods of forming the same
0
‌
US Patent 12125819 Die on die bonding structure
0
‌
US Patent 12131974 Semiconductor package and method of manufacturing semiconductor package
0
•••
Patent Inventor Names
Pei-Ching Kuo
0
Jun-Lin Yeh
0
Ku-Feng Yang
0
Li-Han Hsu
0
Wei-Cheng Wu
0
Wen-Chih Chiou
0
Yi-Hsiu Chen
0
Yung-Chi Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9425126
Patent Primary Examiner
‌
Matthew Reames

Find more entities like US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.