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US Patent 9385455 High density connector

Patent 9385455 was granted and assigned to Molex on July, 2016 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11996654 Controlled-impedance compliant cable termination
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Patent Citations Received
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US Patent 11842138 Integrated routing assembly and system using same
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Patent abstract

A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A commoning member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

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Patent Inventor Names
Kent E. Regnier0
Michael Rowlands0
Patrick R. Casher0
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US Patent 09385455 High density connector US Patent 9385455 High density connector

Infobox
Patent Number
093854550
Patent Number
93854550
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=093854550
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Infobox
Is a
Patent
Patent
0
Patent Applicant
Molex
Molex
0
Current Assignee
Molex
Molex
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
093854550
Date of Patent
July 5, 2016
0
Patent Application Number
148828330
Date Filed
October 14, 2015
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=093854550
Patent Primary Examiner
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Khiem Nguyen
0
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=09385455
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 US Patent 09385455 High density connector

Infobox
Is a
Patent
Patent
Patent applicant
Molex
Molex
Current assignee
Molex
Molex
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
09385455
Date of patent
July 5, 2016
Patent application number
14882833
Date Filed
October 14, 2015
Patent primary examiner
‌
Khiem Nguyen

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