Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 28, 2016
Patent Application Number
14622346
Date Filed
February 13, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.
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