Patent attributes
Apparatus and methods are described herein for cleaving an optical element at a defined distance from a splice (or other reference point/feature) of the optical element within a desired precision and/or accuracy. In some embodiments, a method includes receiving an indication of a location of a feature in an intermediate optical assembly visible within an image of the intermediate optical assembly. The feature can be for example, a splice. A position of the intermediate optical assembly is translated relative to a cleave unit based on the indication. After translating, the intermediate optical assembly, the intermediate optical assembly is cleaved to form an optical assembly that has an end face at a location disposed at a non-zero distance from the location of the feature. In some embodiments, the location of the feature can be determined with an image recognition system.
