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US Patent 9339972 Increased inter-layer bonding in 3D printing

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Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
93399720
Patent Inventor Names
Mark Gordon0
Date of Patent
May 17, 2016
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Patent Application Number
146224730
Date Filed
February 13, 2015
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Patent Citations Received
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US Patent 11911958 Method and apparatus for additive manufacturing with preheat
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US Patent 11759863 Three-dimensional printing
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US Patent 11833820 Printer nozzle structure
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Patent Primary Examiner
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Leo B. Tentoni
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Patent abstract

Inter-layer bonding in objects manufactured by 3D printing techniques is improved by one or more targeted heat sources (THSs) that preheat a targeted portion of existing object material before additional material is added to the object. 3D Printing is also improved, optimized or calibrated by pre- or post-heating a targeted area. THS elements may be fixed, mobile, or a combination thereof to apply heat to targeted areas. A THS may be integrated in or as an add-on to an existing 3D printer. A THS controller may use 3D printer information, such as a current direction or a future direction of printing, to select one or more THSs and to perform other targeted heat operations, such as setting energy levels, aiming, moving, etc. Properties, e.g., strength, of 3D printed objects with improved interlayer bonding may, for example, be several multiples better than the same object printed without improved interlayer bonding.

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