US Patent 9330813 Conductive path structure and wire harness
Patent 9330813 was granted and assigned to Yazaki on May, 2016 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 6, 2011
0
Date of Patent
May 3, 2016
0
Patent Application Number
13819029
0
Patent Citations Received
Patent Inventor Names
Hidehiko Kuboshima
0
Hideomi Adachi
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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