Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jay Salmon0
Date of Patent
April 19, 2016
0Patent Application Number
139713820
Date Filed
August 20, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
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