Patent attributes
A package for a solar cell is provided having laminates formed by stacked lead frames to form an integral package supporting a solar cell structure. Lead frames serve as a heat sink, raised portions match a cavity in a middle lead frames that contain and hold individual solar cell chips in place. Beveled interior edges of a carrier lead frame are in electrical contact with bus bars on the periphery of a suspended solar cell and form the electrical connection for the cell, maximizing current handling capability and allowing the use of spring tension and/or a bonding compound for additional connection strength and integrity. Such a “stackable” semiconductor package requires no ribbon bonding and has multiple bias options, maximum scalability, enhanced moisture resistance, and multiple attachment options for heat sink attachment.
