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US Patent 9196559 Directly sawing wafers covered with liquid molding compound

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 8, 2013
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Date of Patent
November 24, 2015
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Patent Application Number
13789955
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Patent Citations Received
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US Patent 12125794 Semiconductor device and manufacturing method of semiconductor device
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US Patent 12068271 Semiconductor device structure and methods of forming the same
0
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US Patent 12074066 Integrated circuit component with conductive terminals of different dimensions and package structure having the same
0
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US Patent 12125741 Semiconductor package and method of fabricating semiconductor package
0
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US Patent 11756870 Stacked via structure disposed on a conductive pillar of a semiconductor die
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US Patent 11756913 Semiconductor device structure and methods of forming the same
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US Patent 11855030 Package structure and method of manufacturing the same
0
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US Patent 11862512 Semiconductor package and method of fabricating semiconductor package
0
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US Patent 11908835 Semiconductor structure and manufacturing method thereof
0
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US Patent 11942451 Semiconductor structure and method of forming the same
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
9196559
0
Patent Primary Examiner
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Matthew Landau
0

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