Patent attributes
Disclosed is a block copolymer composition for a hot melt adhesive, comprising a block copolymer A and a block copolymer B each having a particular structure, characterized in that the aromatic vinyl monomer unit content of the block copolymer A is 30% to 50% by weight; the aromatic vinyl monomer unit content of the block copolymer B is 15% to 25% by weight; a content of the aromatic vinyl monomer units relative to all polymer components of the block copolymer composition is 18% to 45% by weight; the weight ratio (A/B) of the block copolymer A with respect to the block copolymer B is 20/80 to 80/20; and the ratio (MwA/MwB) of the weight average molecular weight of the block copolymer A (MwA) with respect to the weight average molecular weight of the block copolymer B (MwB) is 0.65 to 1.5.
