Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 17, 2015
Patent Application Number
13222332
Date Filed
August 31, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
According to one embodiment, a semiconductor substrate, a redistribution trace, and a surface layer are provided, with the surface layer provided on the redistribution trace. On the semiconductor substrate, a wire and a pad electrode are formed. The redistribution trace is formed on the semiconductor substrate. The surface layer is larger in width than the redistribution trace, and extends beyond the edge of the redistribution trace.
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